BGA flip chip

DeepMaterial offers high performing materials for Sintering and Die Attach, Surface Mount, and Wave Soldering applications. The breadth of products includes Silver Sinter Technologies,
Website
https://www.epoxyadhesiveglue.com/case-in-usa-american-partners-chip-underfill-solution/
Địa chỉ
Guangdong, China
Gender
Male
Occupation
BGA flip chip underfill epoxy adhesive
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